Product Introduction
Wafer Grinding Tape is widely used in the front-end process of semiconductor packaging and is applied to the circuit-bearing surface of wafers. During the grinding and thinning process, it protects the circuitry, provides mechanical support, and absorbs mechanical stress generated during grinding, while protecting the wafer from acid and alkaline corrosion during subsequent processes.
Typical Applications
Wafer Frontside Taping
Wafer Flipping & Fixation
Wafer Backside Grinding
Recommended Models
Model | Product Features | Processing Conditions | Bump Height Range (μm) | Carrier | Color | Thickness | Adhesion Before UV (gf/25mm) | Adhesion After UV (gf/25mm) |
|---|---|---|---|---|---|---|---|---|
UC1028 | Hard adhesive, high uniformity, suitable for advanced packaging | Advanced packaging, SDBG process | ≤10 | PET Composite Film | Transparent | 100μm | >800 | <30 |
UC1030 | Soft adhesive, high initial tack, excellent filling performance and acid resistance, with excellent residue resistance | Wafer surface grinding | ≤15 | EVA | Light Blue | 130μm | >300 | <30 |
UC1050 | Soft adhesive, excellent filling performance, low rebound, excellent conformability, and superior residue resistance | Medium-bump wafer grinding | 30-100 | PO | Light Blue | 230μm | >500 | <30 |
UC1100 | Stable adhesive properties, excellent conformability, and filling performance | High-bump wafer grinding | 100-300 | PET Composite Film | Frosted White | 440μm | >300 | <100 |
UN1023 | Soft adhesive, excellent acid resistance and residue resistance | Wafer surface grinding | ＜10 | PO | Light Blue | 150μm | 100-300 | 100-300 |
UN1024 | Soft adhesive with a thick adhesive layer, excellent acid resistance and residue resistance | Low-bump wafer grinding | ＜30 | EVA | Light Blue | 170μm | 150-350 | 150-350 |
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