Product Introduction
Molding Protection Tape is used to bond to metal lead frames and provides support and protection during the molding process in semiconductor packaging, preventing adhesive overflow and contamination during Epoxy Molding Compound (EMC) molding. Depending on whether taping is performed before or after the Die-Attach / Wire-Bond process, it can be classified into two types: Pre-Taping Process and Post-Taping Process.
Typical Applications
Die Attach
Frontside Mounting
Backside Mounting
Recommended Models
Model | Carrier Film (μm) | Appearance Color | Thickness (μm) | Peel Strength (gf/25mm) | Rolling Ball Tack (#) | Release Agent | Typical Applications |
|---|---|---|---|---|---|---|---|
TF3020S | 25 | Brown | 10 | 70~120 | 10 | Fluorine-based | Post-Taping |
TF3036S | 25 | Brown | 10 | 70~120 | 10 | n.a | Post-Taping |
TF3043S | 25 | Brown | 10 | 40~100 | 6 | Fluorine-based | Pre-Taping |
TF4004 | 25 | Brown | 3 | / | / | n.a | Pre-Taping – Heat-Press Activated |
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