Product Introduction
Wafer Dicing Tape is used to secure and support wafers during the dicing process and is typically applied to the circuit-free backside of the wafer. The film used in wafer dicing tape offers excellent elongation and isotropic properties. Based on whether UV irradiation is required for debonding, wafer dicing tapes are available in two types: UV-curable type and non-UV type. For the UV type, adhesive strength is significantly reduced after UV exposure following the dicing process, facilitating the pickup of individual dies.
Typical Applications
Wafer Dicing
Recommended Models
Model | Carrier Film | Appearance Color | Thickness (μm) | Peel Strength Before UV (g/25mm) | Peel Strength After UV (g/25mm) | Typical Applications |
|---|---|---|---|---|---|---|
UC2073 | PVC | Blue | 10 | 280 | 30 | Wafer dicing, comparable to D-175 |
UC2171 | PO | Translucent | 5 | 500 | 15 | Wafer dicing, comparable to D-485H |
UC2170 | PO | Translucent | 10 | 800 | 15 | Wafer dicing, thickened version of D-485H |
UN2004 | PVC | Blue | 80 | 60-140 | 60-140 | For wafer dicing, comparable to V-8AR |
UN2014 | PVC | Blue | 80 | 60-140 | 60-140 | For dicing and process protection, self-wound type comparable to SPV-224 |
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