Product Introduction
Packaging Dicing Tape is a type of UV debonding dicing tape used in semiconductor packaging processes to support and secure lead frames encapsulated with Epoxy Molding Compound (EMC) during dicing. After dicing, UV exposure significantly reduces the tape’s peel strength, facilitating the subsequent unloading and separation of individual dies.
Typical Applications
Package Dicing
Recommended Models
Model | Carrier Film | Dicing Size (0.1 mm) | Thickness (μm) | Peel Strength Before UV (gf/25mm) | Peel Strength After UV (gf/25mm) | Typical Applications |
|---|---|---|---|---|---|---|
UC 2137 | PO | 10*06 | 165 | 1500-2000 | ≤20 | Package dicing, comparable to 6360-95 |
UC 2111 | PO | 20*20 | 165 | 1800-2200 | ≤20 | Package dicing, BGA |
UC 2165 | PO | 10*06 | 160 | 800-1000 | ≤20 | Package dicing, high-roughness surfaces |
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