Product Introduction
Molding Release Film is used in the molding process of semiconductor packaging. It serves as a temporary interface between the mold and the molding compound, preventing adhesion between the mold, chip surface, and molding resin under high-temperature and high-pressure conditions. It also protects the mold and chip surface, ensures uniform transfer of molding pressure, and helps prevent resin flash.
Typical Applications
It is available in two configurations: top mounting and bottom mounting.
Recommended Models
Model | Structure | Features | Temperature Resistance | Carrier | Thickness (μm) |
|---|---|---|---|---|---|
TF2002 | With Adhesive | Single-sided matte finish, Ra < 0.5, with excellent resin-blocking performance | 180℃ 0.5H | PET | 77±3 |
TF4001 | Without Adhesive | Double-sided matte finish, Ra < 0.5 | 180℃ 0.5H | PET | 45-50 |
TF4002 | Without Adhesive | Single-sided matte finish, Ra < 0.5 | 180℃ 0.5H | PET | 41-45 |
NS2002 | Non-Silicone Release Film | Release force of approximately 300 gf/in | 180℃ 0.5H | PET | 41-45 |
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