Product Introduction
De-Taping Tape is used to remove protective films from substrates, such as removing wafer grinding tape from the wafer surface after grinding. Film Removal Tape is available in two types: conventional cold-applied type and hot-melt type.
Typical Applications
Conventional Applications
Hot-Melt Applications
Recommended Models
Model | Features | Carrier | Color | Thickness (μm) | Application Temperature (°C) | Adhesion (gf/25mm) |
|---|---|---|---|---|---|---|
UN4003 | Conventional Type | PET | Transparent | 80 | 23±5 | ＞2000 |
TR4003 | Hot-Melt Type | PET | Milky White | 80 | 100-230 | ＞1000 |
TR4006 | Hot-Melt Type | PET | Milky White | 115 | 100-230 | ＞1000 |
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