Discover Automotive Bonding Solutions
Automotive exterior
Automotive Exterior Bonding Solutions
Automotive interior
Automotive Interior Bonding Solutions
Rearview mirror
Automotive Side/Rear Mirror Bonding Solutions
Automobile Display
In-Vehicle Display Bonding Solutions
Discover Consumer Electronics Bonding Solutions
OLED Display
OLED Display Module Bonding Solutions
LCD Display
LCD Display Module Bonding Solutions
Assembly fixing application
Assembly and Fixture Bonding Solutions
Functional application
Functional Application Bonding Solutions
Application of protective film
Protective Film Bonding Solutions
Sustainable application
Sustainable Bonding Solutions
Smartphone
Smartphone Bonding Solutions
Exploring Adhesive Material Applications in the Semiconductor Industry
Semiconductor Process Solutions
Semiconductor Process Solutions
Discover Green Energy Bonding Solutions
Energy Battery
Energy Battery Bonding Solutions
探索绿色能源行业的胶粘材料应用
Discover Home Appliances Bonding Solutions
Refrigerator
Refrigerators Bonding Solutions
OLED Television
OLED Television Bonding Solutions
Television
Televisions Bonding Solutions
Air Conditioner
Air Conditioner Bonding Solutions
Membrane Switch
Membrane Switch Bonding Solutions
High-Temperature Applications
High-Temperature Applications Bonding Solutions
Discover Internet of Things Bonding Solutions
Smart Glasses
Smart Glasses Bonding Solutions
Smart Glasses Case
Smart Glasses Case Bonding Solutions
Smart Speaker
Smart Speaker Bonding Solutions
Metaverse
Metaverse Bonding Solutions
Smartwatch
Smartwatch Bonding Solutions
Discover Home Living Bonding Solutions
Festive Decorations
Festive Decoration Bonding Solutions
Nail Art & Fashion
Nail Art & Fashion Bonding Solutions
Home Living
生活家居粘接解决方案
Office & Study
Office & Study Bonding Solutions
Discover Innovative Packaging Bonding Solutions
Electronics Packaging
Electronics Packaging Bonding Solutions
Carton Sealing Packaging
Electronics Packaging Bonding Solutions
Eco-Friendly Packaging
Electronics Packaging Bonding Solutions
Discover Transportation Bonding Solutions
Rail Transit
Rail Transit Bonding Solutions
Discover Industrial Manufacturing Bonding Solutions
Apparel & Luggage
Apparel & Luggage Bonding Solutions
Discover Other Industry Bonding Solutions
Elevator
Elevator Bonding Solutions
Wafer Grinding Tape
  • Excellent conformability with superior water and dust resistance.
  • Residue-free removal, leaving no adhesive residue on the wafer surface.
  • Stable tension to prevent wafer warpage and breakage.
  • High thickness precision and uniformity, meeting TTV (Total Thickness Variation) requirements.
ModelProduct FeaturesProcessing ConditionsBump Height Range (μm)CarrierColorThicknessAdhesion Before UV  (gf/25mm)Adhesion After UV (gf/25mm)
UC1028Hard adhesive, high uniformity, suitable for advanced packagingAdvanced packaging, SDBG process≤10PET Composite FilmTransparent100μm>800<30
UC1030Soft adhesive, high initial tack, excellent filling performance and acid resistance, with excellent residue resistanceWafer surface grinding≤15EVALight Blue130μm>300<30
UC1050Soft adhesive, excellent filling performance, low rebound, excellent conformability, and superior residue resistanceMedium-bump wafer grinding30-100POLight Blue230μm>500<30
UC1100Stable adhesive properties, excellent conformability, and filling performanceHigh-bump wafer grinding100-300PET Composite FilmFrosted White440μm>300<100
UN1023Soft adhesive, excellent acid resistance and residue resistanceWafer surface grinding<10POLight Blue150μm100-300100-300
UN1024Soft adhesive with a thick adhesive layer, excellent acid resistance and residue resistanceLow-bump wafer grinding<30EVALight Blue170μm150-350150-350
Film Removal Tape

Conventional Type

  • High initial tack for efficient and rapid operation.
  • High peel strength for excellent film removal performance.

Hot-Melt Type

  • Instant heat melting, high film removal force, and excellent film removal performance.
  • Wide heating range and broad application conditions.
ModelFeaturesCarrierColorThickness (μm)Application Temperature (°C)Adhesion (gf/25mm)
UN4003Conventional TypePETTransparent8023±5>2000
TR4003Hot-Melt TypePETMilky White80100-230>1000
TR4006Hot-Melt TypePETMilky White115100-230>1000
Wafer Dicing Tape
  • High adhesion
  • No edge chipping or die flying during dicing
  • Easy peeling with no adhesive residue
  • Excellent conformability
  • Excellent die pick-up performance

 

ModelCarrier FilmAppearance ColorThickness (μm)

Peel Strength Before UV

 (g/25mm)

Peel Strength After UV

(g/25mm)

Typical Applications
UC2073PVCBlue1028030Wafer dicing, comparable to D-175
UC2171POTranslucent550015Wafer dicing, comparable to D-485H
UC2170POTranslucent1080015Wafer dicing, thickened version of D-485H
UN2004PVCBlue8060-14060-140For wafer dicing, comparable to V-8AR
UN2014PVCBlue8060-14060-140For dicing and process protection, self-wound type comparable to SPV-224
Molding Protection Tape
  • High temperature resistance (200–300°C)
  • High adhesion
  • Bubble-free bonding with excellent air release
  • No adhesive overflow or residue
ModelCarrier Film (μm)Appearance ColorThickness (μm)Peel Strength (gf/25mm)Rolling Ball Tack (#)Release AgentTypical Applications
TF3020S25棕色1070~12010Fluorine-basedPost-Taping
TF3036S25棕色1070~12010n.aPost-Taping
TF3043S25棕色1040~1006Fluorine-basedPre-Taping
TF400425棕色3//n.aPre-Taping – Heat-Press Activated
Molding Release Film
  • Excellent high-temperature resistance without deformation
  • No adhesive residue and no impact on coatings
  • Excellent resin-blocking performance
  • Easy to peel off
ModelStructureFeaturesTemperature ResistanceCarrierThickness (μm)
TF2002With AdhesiveSingle-sided matte finish, Ra < 0.5, with excellent resin-blocking performance180℃ 0.5HPET77±3
TF4001Without AdhesiveDouble-sided matte finish, Ra < 0.5180℃ 0.5HPET45-50
TF4002Without AdhesiveSingle-sided matte finish, Ra < 0.5180℃ 0.5HPET41-45
NS2002Non-Silicone Release FilmRelease force of approximately 300 gf/in180℃ 0.5HPET41-45
Packaging Dicing Tape
  • High adhesion
  • No edge chipping or die flying during dicing
  • Easy peeling with no adhesive residue
  • Excellent conformability
  • Excellent die pick-up performance

 

ModelCarrier FilmDicing Size (0.1 mm)Thickness (μm)Peel Strength Before UV  (gf/25mm)Peel Strength After UV  (gf/25mm)Typical Applications
UC 2137PO10*061651500-2000≤20Package dicing, comparable to 6360-95
UC 2111PO20*201651800-2200≤20Package dicing, BGA
UC 2165PO10*06160800-1000≤20Package dicing, high-roughness surfaces
Wafer Grinding Tape
Film Removal Tape
Wafer Dicing Tape
Molding Protection Tape
Molding Release Film
Packaging Dicing Tape
Learn More
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