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Discover Home Living Bonding Solutions
Discover Innovative Packaging Bonding Solutions
Discover Transportation Bonding Solutions
Discover Industrial Manufacturing Bonding Solutions
Discover Other Industry Bonding Solutions
Wafer Grinding Tape
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| Model | Product Features | Processing Conditions | Bump Height Range (μm) | Carrier | Color | Thickness | Adhesion Before UV (gf/25mm) | Adhesion After UV (gf/25mm) |
| UC1028 | Hard adhesive, high uniformity, suitable for advanced packaging | Advanced packaging, SDBG process | ≤10 | PET Composite Film | Transparent | 100μm | >800 | <30 |
| UC1030 | Soft adhesive, high initial tack, excellent filling performance and acid resistance, with excellent residue resistance | Wafer surface grinding | ≤15 | EVA | Light Blue | 130μm | >300 | <30 |
| UC1050 | Soft adhesive, excellent filling performance, low rebound, excellent conformability, and superior residue resistance | Medium-bump wafer grinding | 30-100 | PO | Light Blue | 230μm | >500 | <30 |
| UC1100 | Stable adhesive properties, excellent conformability, and filling performance | High-bump wafer grinding | 100-300 | PET Composite Film | Frosted White | 440μm | >300 | <100 |
| UN1023 | Soft adhesive, excellent acid resistance and residue resistance | Wafer surface grinding | <10 | PO | Light Blue | 150μm | 100-300 | 100-300 |
| UN1024 | Soft adhesive with a thick adhesive layer, excellent acid resistance and residue resistance | Low-bump wafer grinding | <30 | EVA | Light Blue | 170μm | 150-350 | 150-350 |
Film Removal Tape
Conventional Type
| Hot-Melt Type
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| Model | Features | Carrier | Color | Thickness (μm) | Application Temperature (°C) | Adhesion (gf/25mm) |
| UN4003 | Conventional Type | PET | Transparent | 80 | 23±5 | >2000 |
| TR4003 | Hot-Melt Type | PET | Milky White | 80 | 100-230 | >1000 |
| TR4006 | Hot-Melt Type | PET | Milky White | 115 | 100-230 | >1000 |
Wafer Dicing Tape
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| Model | Carrier Film | Appearance Color | Thickness (μm) | Peel Strength Before UV (g/25mm) | Peel Strength After UV (g/25mm) | Typical Applications |
| UC2073 | PVC | Blue | 10 | 280 | 30 | Wafer dicing, comparable to D-175 |
| UC2171 | PO | Translucent | 5 | 500 | 15 | Wafer dicing, comparable to D-485H |
| UC2170 | PO | Translucent | 10 | 800 | 15 | Wafer dicing, thickened version of D-485H |
| UN2004 | PVC | Blue | 80 | 60-140 | 60-140 | For wafer dicing, comparable to V-8AR |
| UN2014 | PVC | Blue | 80 | 60-140 | 60-140 | For dicing and process protection, self-wound type comparable to SPV-224 |
Molding Protection Tape
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| Model | Carrier Film (μm) | Appearance Color | Thickness (μm) | Peel Strength (gf/25mm) | Rolling Ball Tack (#) | Release Agent | Typical Applications |
| TF3020S | 25 | 棕色 | 10 | 70~120 | 10 | Fluorine-based | Post-Taping |
| TF3036S | 25 | 棕色 | 10 | 70~120 | 10 | n.a | Post-Taping |
| TF3043S | 25 | 棕色 | 10 | 40~100 | 6 | Fluorine-based | Pre-Taping |
| TF4004 | 25 | 棕色 | 3 | / | / | n.a | Pre-Taping – Heat-Press Activated |
Molding Release Film
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| Model | Structure | Features | Temperature Resistance | Carrier | Thickness (μm) |
| TF2002 | With Adhesive | Single-sided matte finish, Ra < 0.5, with excellent resin-blocking performance | 180℃ 0.5H | PET | 77±3 |
| TF4001 | Without Adhesive | Double-sided matte finish, Ra < 0.5 | 180℃ 0.5H | PET | 45-50 |
| TF4002 | Without Adhesive | Single-sided matte finish, Ra < 0.5 | 180℃ 0.5H | PET | 41-45 |
| NS2002 | Non-Silicone Release Film | Release force of approximately 300 gf/in | 180℃ 0.5H | PET | 41-45 |
Packaging Dicing Tape
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| Model | Carrier Film | Dicing Size (0.1 mm) | Thickness (μm) | Peel Strength Before UV (gf/25mm) | Peel Strength After UV (gf/25mm) | Typical Applications |
| UC 2137 | PO | 10*06 | 165 | 1500-2000 | ≤20 | Package dicing, comparable to 6360-95 |
| UC 2111 | PO | 20*20 | 165 | 1800-2200 | ≤20 | Package dicing, BGA |
| UC 2165 | PO | 10*06 | 160 | 800-1000 | ≤20 | Package dicing, high-roughness surfaces |
Wafer Grinding Tape
Film Removal Tape
Wafer Dicing Tape
Molding Protection Tape
Molding Release Film
Packaging Dicing Tape
Learn More
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