CROWN Conductive Tapes and EMI Absorbers Enable Stable and Efficient Operation of AI Servers and Data Centers

With the rapid development of generative AI, large language models, and high-performance computing, AI servers and data centers are entering a period of accelerated growth. TrendForce forecasts that global AI server shipments will increase by nearly 31% year over year in 2026.

The rapid expansion of AI computing infrastructure is driving servers toward higher power, higher frequencies, greater density, and faster interconnects. As 800G and higher-speed network interconnects are increasingly adopted in AI data centers, electromagnetic interference (EMI) generated during high-speed signal transmission is becoming an increasingly important challenge.

Meanwhile, high-density server racks must simultaneously address requirements for thermal management, airflow, signal integrity, and EMI shielding. The global EMI shielding market is projected to grow from approximately US$8.04 billion in 2026 to US$10.9 billion by 2032, representing a CAGR of approximately 5.2% from 2026 to 2032. As AI computing infrastructure continues to expand, the application potential for EMI/EMC solutions is expected to grow further.

To address the electromagnetic compatibility and signal integrity requirements of AI servers and data centers, CROWN provides EMI/EMC material solutions covering electromagnetic shielding and electromagnetic wave absorption. Its portfolio includes conductive tapes and EMI absorbers for applications such as server chassis, PCBs, connectors, high-speed cables, power modules, and data center equipment, providing reliable solutions for EMI shielding, electrical grounding, and electromagnetic wave absorption.

CROWN Conductive Tapes

CROWN conductive tapes are designed for EMI shielding, electrical conductivity, and grounding applications. A variety of carrier materials and product structures are available to meet different structural, substrate, and processing requirements. (https://en.crown.com.cn/Product_2/55.html)

· Conductive Adhesive Transfer Tape
Featuring low electrical resistance, high adhesion, and excellent transferability, it can be combined with conductive materials to achieve stable electrical connections and effective EMI shielding. It is particularly suitable for applications requiring ultra-thin construction and high electrical conductivity.

· Conductive Nonwoven Fabric Tape
Featuring a soft carrier, excellent die-cutting performance, resistance to lifting, and good aging resistance, it is suitable for bonding curved surfaces and complex structures, meeting diverse EMI shielding requirements.

· Conductive Woven Fabric Tape
Featuring excellent aging resistance, tear resistance, and dynamic flex performance, it can also provide a certain degree of cushioning or spacing where required. It is suitable for cable and wire harness wrapping and EMI shielding.

· Conductive Copper Foil Tape
Offering good electrical conductivity, oxidation resistance, and resistance to lifting or rebound, conductive copper foil tape also provides a certain level of thermal dissipation. It can be used for shielding covers on PCBs, display modules, and other EMI shielding or conductive bonding applications in servers and electronic devices.

· Conductive Foam Tape
Combining low electrical resistance with high resilience, conductive foam tape provides both cushioning and effective EMI shielding. It is suitable for shielding covers at FPC interfaces and conductive bonding between structural components in servers and other electronic equipment.

CROWN EMI Absorbers

In addition to electromagnetic shielding, CROWN provides EMI absorber solutions for managing complex electromagnetic environments inside electronic devices. By absorbing and attenuating electromagnetic waves, these materials help reduce interference caused by electromagnetic reflection and propagation. (https://en.crown.com.cn/Product_2/59.html)

· General-Purpose EMI Absorbers
Featuring an ultra-thin profile, excellent die-cutting performance, and outstanding aging resistance, these absorbers are designed for EMI control in the 0–3 GHz frequency range. Typical applications include mainboard ICs, antennas, memory modules, and component interconnections.

· High-Frequency EMI Absorbers
Featuring excellent flexibility, multiple thickness options, and outstanding aging resistance, these absorbers are designed for EMI control in the 1–10 GHz frequency range. They are suitable for high-frequency applications such as 2.4 GHz Wi-Fi, helping reduce harmonic interference.

· Composite EMI Absorbers
These materials can be combined with other functional materials according to specific application requirements and can be customized based on customer specifications, thickness, and performance requirements.

EMI/EMC Material Solutions for AI Computing Infrastructure

As AI servers continue to evolve toward higher computing power, higher power density, greater integration, and faster interconnects, electromagnetic compatibility has become an increasingly important consideration in server and data center equipment.

By combining conductive tapes and EMI absorbers, CROWN has developed a versatile EMI/EMC material portfolio covering electromagnetic shielding, electrical grounding, electromagnetic wave absorption, and attenuation.

These solutions provide flexible and efficient approaches to EMI control across AI servers and data center equipment, supporting the stable and efficient operation of next-generation AI computing infrastructure.