Product Introduction
TSF (Thermosetting Film) is a heat-activated adhesive film with thermosetting properties. At room temperature, it has no adhesive properties. During the heating process, the adhesive film undergoes a chemical cross-linking reaction, curing into a solid structure with excellent stability. The adhesion strength can range from semi-structural to full structural strength, making it suitable for high-strength bonding of various materials. It offers a variety of activation temperatures, excellent die-cutting capability, and superior performance, providing convenience for industrial production. In addition to the heat-reactive series, there is also a UV-activated series (UVAF, UV-activated Film) available.
Typical Applications
Soft Material Bonding
High-Strength Component Bonding
Recommended Models
Series | Grade Name | Thickness | Adhesive | Activation Temperature | Series Color |
|---|---|---|---|---|---|
TSF Thermosetting Film (For Soft Material Bonding) | CRN-DPxxxWH | 30-300 | PU | 75 | White / Black |
TSF Thermosetting Film (For Component Bonding) | CRN-DPxxxWH | 30-300 | PU | 75 | White / Black |
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