Product Introduction
TSF (Thermosetting Film) is a heat-activated adhesive film with thermosetting properties. At room temperature, it has no adhesive properties. During the heating process, the adhesive film undergoes a chemical cross-linking reaction, curing into a solid structure with excellent stability. The adhesion strength can range from semi-structural to full structural strength, making it suitable for high-strength bonding of various materials. It offers a variety of activation temperatures, excellent die-cutting capability, and superior performance, providing convenience for industrial production. In addition to the heat-reactive series, there is also a UV-activated series (UVAF, UV-activated Film) available.
Typical Applications
Soft Material Bonding
High-Strength Component Bonding
Recommended Models
Series | Grade Name | Thickness | Adhesive | Activation Temperature | Series Color |
|---|---|---|---|---|---|
TSF Thermosetting Film (For Soft Material Bonding) | CRN-DPxxxWH | 30-300 | PU | 75 | White / Black |
TSF Thermosetting Film (For Component Bonding) | CRN-DPxxxWH | 30-300 | PU | 75 | White / Black |
Related Recommendations
Video Recommendations
Reading Recommendations
Product Consultation
If you are interested in CROWN New Materials’ products or solutions, please fill out the form below. Our team will contact you shortly.
In line with privacy protection, your personal information will be used only to process your request.
No. 10-1 Lefeng 6th Road, Maohui Industrial Park, Henglan Town, Zhongshan City, Guangdong Province, China
